Comlent Commences Volume Shipment of RF Power Amplifier for Digital Enhanced Cordless Telephony (DECT) Standard in European Market

Comlent, China's leading fabless radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang High Tech Park, announced today that it has begun volume shipment of an RF power amplifier (PA) targeted for the Digital Enhanced Cordless Telephony (DECT) standard in the European market.

SHANGHAI, China (PRWEB) February 28, 2005 -- Comlent, a fabless radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang High Tech Park, announced today that it has begun volume shipment of an RF power amplifier (PA) targeted for the Digital Enhanced Cordless Telephony (DECT) standard in the European market.
   
The Comlent PA operates at 1.9GHz and utilizes Jazz Semiconductor’s 0.35um BiCMOS process. It has a 3-stage design that offers up to 30dB gain and 24-dBm of output power. A specially designed QFN-16 package is used to provide good electrical performance and heat conduction.

The DECT digital cordless phone market in Europe has experienced strong growth in recent years, with approximately 30 million units shipped in 2003. In addition, the DECT market expects further growth due to the transition of the North American cordless phone market from the existing 2.4GHz Digital Spread Spectrum (DSS) technology to the DECT standard, which began early this year. The combined cordless phone market of Europe and North America is expected to exceed 60 million phones per year, which translates into a market demand of greater than 120 million DECT power amplifiers.

Comlent’s investors include leading venture capital institutional investors such as Intel Capital, 3i and Draper Fisher Jurvetson, Shanghai municipal and Zhangjiang High Tech Park venture funds as well as top executives from several leading semiconductor companies in the US, Taiwan and Europe.

“In the past two and a half years, Comlent has invested millions of U.S. dollars in R&D to develop proprietary and patented IP for RFIC designs in both CMOS and BiCMOS technologies. Comlent’s recent sampling of China’s first complete RFIC transceiver and PA, which leverages Jazz Semiconductor’s modular BiCMOS process, coupled with the swift market acceptance of Comlent’s PA for DECT phones in the European market further supports Comlent’s market and product positioning as well as our technology capability and leadership in China,” says co-founder and CEO of Comlent, Dr. Kai Chen. “Comlent will relentlessly strengthen and execute our business vision and mission to provide world class RFIC technology, along with technical support, service and quality, to enable our customers to win in the domestic and global marketplaces.”

“Jazz Semiconductor is pleased to support Comlent, one of China's leading RFIC design houses, in addressing the rapidly growing wireless terminal market in China,” stated Paul Kempf, chief technology and marketing officer at Jazz Semiconductor. “Comlent’s continued success in meeting both technology and business milestones further reinforces our confidence and commitment to these emerging markets."

About Comlent:
Established in 2002, Comlent, a fabless radio frequency integrated circuit (RFIC) design house headquartered in Zhangjiang High Tech Park, Shanghai, China, is a leading RFIC provider that focuses on the exploding wireless communication market of China. Initial products of Comlent include RFIC transceivers in both CMOS and BiCMOS technologies for mobile handsets in 1.9GHz-2.4GHz frequency range. Comlent provides enabling RFIC technology, strong support and quality service to serve China’s mobile communication market that has 300+ million mobile phone and 70 million PHS/PAS subscribers, 400 million domestic TV sets and manufacturers of 70 million cordless phone units per year. For more information, please visit www.Comlent.com.

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Source :  http://www.prweb.com/releases/2005/2/prweb210102.htm